<![CDATA[Si Deep-RIE]]><![CDATA[<div class="ed_model05 clearfix">
<div class="ed_pic_right"><img alt="Silicon Deep Etch System" src="/ord/en/app/machine/image?module=corefacilities&detailNo=1168759059810095104&init=N" /></div>
<div class="ed_list">
<ul>
<li><a href="https://nanofc.web.nycu.edu.tw/%e7%9f%bd%e6%b7%b1%e8%9d%95%e5%88%bb%e7%b3%bb%e7%b5%b1si-deep-rie/" rel="noreferrer noopener" target="_blank" title="Si Deep-RIE(Open New Windows)">Si Deep-RIE</a><br />
Brand Model: Oxford Estrelas 100</li>
<li><strong>Instrument expert: Prof.</strong> <strong>Chen, Kuan-Neng</strong><br />
03-5712121 ext 31558</li>
<li><strong>Equipment management personnel: Mr. Hu, Jack</strong><br />
03-5712121 ext 55607, 55666<br />
Email <a href="mailto:jackhu@nycu.edu.tw" title="jackhu@nycu.edu.tw">jackhu@nycu.edu.tw</a></li>
<li><strong>Equipment management personnel: Mr. Lee, James</strong><br />
03-5712121 ext 55660, 55666<br />
Email <a href="mailto:cwlee@nycu.edu.tw" title="cwlee@nycu.edu.tw">cwlee@nycu.edu.tw</a></li>
<li><strong>Instrument location: Laboratory 116, 1st Floor, Solid State Electronic Systems Building, Guanfu Campus</strong></li>
</ul>
</div>
</div>]]>NanofabricationInstrumentation Resource Center 2026-05-21Instrument introduction<div class="ed_model01 clearfix">
<div class="ed_txt"><strong><a href="https://nanofc2.web.nycu.edu.tw/si-deep-rie/" title="Link to Nano Center Introduction Page">Nano Facility Center</a><br />
<br />
Instrument Information</strong></div>
<ol>
<li class="ed_txt">Brand Model: Oxford Estrelas 100</li>
<li class="ed_txt">Purchase period: December 2016</li>
<li class="ed_txt">Place of placement: Laboratory 116, 1st Floor, Solid State Electronic Systems Building, Guanfu Campus (TEL: 55666)</li>
<li class="ed_txt">Function: dry etching, mainly silicon deep etching (Bosch Process)</li>
<li class="ed_txt">Important specifications: The gas used includes C4F8, SF6, CHF3, CF4, Ar, O2, cooled by He gas system, mainly 4″ wafer</li>
<li class="ed_txt">The instrument can be used with <a href="/userfiles/orden/files/20240612094413281.pdf" rel="noreferrer noopener" target="_blank" title="special process material(pdf)(Open New Windows)">special process material</a></li>
</ol>
</div>Precautions<div class="ed_model01 clearfix">
<div class="ed_txt"><strong>Precautions</strong></div>
<ol>
<li class="ed_txt">Please specify the material of the substrate wafer, what kind of substances (such as SiO2, photoresist, etc.) are contained on it, and whether to remove the photoresist after etching (an additional Wet Bench application form is required).</li>
<li class="ed_txt">Silicon deep etching sample preparation please follow <a href="/userfiles/orden/files/20240612094435521.pdf" rel="noreferrer noopener" target="_blank" title="Test piece regulations(pdf)(Open New Windows)">Test piece regulations</a>.</li>
</ol>
</div>Do-it-yourself regulations<div class="ed_model01 clearfix">
<div class="ed_txt"><strong>self-operated instrument</strong></div>
<ol>
<li>Instructions for obtaining the permission to use the instrument:
<ul>
<li><a href="https://nanofc.web.nycu.edu.tw/%e5%a5%88%e7%b1%b3%e4%b8%ad%e5%bf%83%e7%94%b3%e8%ab%8b%e6%b5%81%e7%a8%8b/" rel="noreferrer noopener" target="_blank" title="Daytime permission application process description(Open New Windows)">Daytime permission application process description</a> (Using permission is Monday to Friday 8:00~17:00)</li>
<li><a href="https://nanofc.web.nycu.edu.tw/24%e5%b0%8f%e6%99%82%e5%90%ab%e5%81%87%e6%97%a5%e9%96%80%e7%a6%81%e5%8f%8a%e8%a8%ad%e5%82%99%e6%ac%8a%e9%99%90%e7%94%b3%e8%ab%8b%e6%b5%81%e7%a8%8b/" rel="noreferrer noopener" target="_blank" title="24-hour application process description(Open New Windows)">24-hour application process description</a> (You need to have daytime permission to apply)</li>
<li><a href="https://nanofc.web.nycu.edu.tw/%e5%84%80%e5%99%a8%e7%94%b3%e8%ab%8b%e6%b3%a8%e6%84%8f%e4%ba%8b%e9%a0%85/" rel="noreferrer noopener" target="_blank" title="Precautions(Open New Windows)">Precautions</a> (Be sure to read carefully, so as not to lose your own rights)</li>
<li>Si Deep-RIE instrument <a href="/userfiles/orden/files/20240612094454254.pdf" rel="noreferrer noopener" target="_blank" title="Operating Specifications(pdf)(Open New Windows)">Operating Specifications</a> & <a href="/userfiles/orden/files/20240612094513871.pdf" rel="noreferrer noopener" target="_blank" title="Exam record sheet(pdf)(Open New Windows)">Exam record sheet</a></li>
</ul>
</li>
<li><a href="https://nanofc.web.nycu.edu.tw/%e5%84%80%e5%99%a8%e9%96%8b%e6%94%be%e7%ad%89%e7%b4%9a%e3%80%81%e4%ba%ba%e6%95%b8%e3%80%81%e8%a8%93%e7%b7%b4%e6%ac%a1%e6%95%b8open-level-open-people-training-times/" rel="noreferrer noopener" target="_blank" title="Instrument opening level and number of people.(Open New Windows)">Instrument opening level and number of people.</a></li>
<li>After you have the right to use the instrument, you need to log in to the following system to obtain the serial number and make an appointment for use:
<ul>
<li>NSTCBasic Research Core Facility Reservation Service Management system (obtain serial number)</li>
<li><a href="https://nfcmachin.ece.nycu.edu.tw/" rel="noreferrer noopener" target="_blank" title="Nano Center Instrument Reservation System(Open New Windows)">Nano Center Instrument Reservation System</a> (Use time slot reservation)</li>
</ul>
</li>
</ol>
</div>Delegated Operation Regulations<div class="ed_model01 clearfix">
<div class="ed_txt"><strong>Commissioning the operation of the instrument</strong></div>
<ol>
<li>If there is an NSTC project, please go to the NSTC Basic Research Core Facility Reservation Service Management system (https://vir.nstc.gov.tw/home/Index). Make reservations and get the reservation number, then download <a href="/userfiles/orden/files/20240612094532399.odt" rel="noreferrer noopener" target="_blank" title="Si Deep-RIE OEM Application Form(odt)(Open New Windows)">Si Deep-RIE OEM Application Form</a>, and send the completed application form and materials to the center (2F, Solid State Electronic System Building of the school) to assist the instrument management personnel in scheduling OEM.</li>
<li>For those without an NSTC project, please download the <a href="/userfiles/orden/files/20240612094546380.odt" rel="noreferrer noopener" target="_blank" title="Si Deep-RIE OEM Application Form(odt)(Open New Windows)">Si Deep-RIE OEM Application Form</a>, and submit the completed application form and materials to the center (2F, Solid State Electronic System Building of the school) to assist the instrument management personnel in scheduling OEM.</li>
</ol>
</div>Charges<div class="ed_model01 clearfix">
<div class="ed_txt"><strong>Charge information</strong></div>
<ol>
<li class="ed_txt"><span style="color:#ff0000;"><strong>Those with an accountant from the National Science Council will be priced according to the plan payment standard, and those without an accountant from the National Science Council will be priced according to the non-plan payment standard.</strong></span></li>
<li class="ed_txt">Payment method:
<ul>
<li class="ed_txt">Do it yourself: charge a fee</li>
<li class="ed_txt">Entrusted operation: charging usage fee + OEM fee</li>
</ul>
</li>
<li class="ed_txt">Cost inquiry link：https://vir.nstc.gov.tw/VI_SearchResult?item=1</li>
</ol>
</div>References<div class="ed_model01 clearfix">
<div class="ed_txt"><a href="https://irc.ord.nycu.edu.tw/en/news/pc_news/20220810-nstc/" rel="noreferrer noopener" target="_blank" title="2022 Yangming Jiaotong University Instrument Resource Center Basic Research Core Facilities Online Technology Sharing Conference Video(Open New Windows)">2022 NYCU Instrumentation Resource Center Basic Research Core Facilities Online Technology Sharing Conference Video</a></div>
</div>https://ord.nycu.edu.tw/ord/en/app/machine/image?module=corefacilities&detailNo=1168759059810095104&init=YSilicon Deep Etch Systemhttps://ord.nycu.edu.tw/ord/en/app/machine/list?module=corefacilities&id=1990List of Instrumentshttps://ord.nycu.edu.tw/ord/en/app/machine/list?module=corefacilities&id=1992Basic Service-Nanofabricationhttps://ord.nycu.edu.tw/ord/en/app/machine/view?module=corefacilities&id=1990&serno=b0eb6b98-f5d6-41d5-84c6-cc35e6ce12a9Shallow Si RIEhttps://ord.nycu.edu.tw/ord/en/app/machine/view?module=corefacilities&id=1990&serno=27dd564a-8602-4dbb-8056-22d5c1c20815High Density Plasma Active Ion Etching System