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Semiconductor Process

exchangealt 中文
  • Update Date：2024-04-29
  • Units：Instrumentation Resource Center
[GuanFu] Flip-chip Bonder
Wafer to Wafer Bonder
  • Flip-chip Bonder
    • Abbreviation: Bonder
    • Brand: Smart Equipment Technology (SET)
    • Model: ACCμRA 100
  • Instrument expert: Prof. Chen, Guan-Neng
    • ext. 31558
  • Instrument Operation Technician: Hsu, Mu-Ping
  • Instrument Location: Room 135, Nano Facility Center
Instrument brand, model, year of purchase
Brand: Smart Equipment Technology (SET)
Model: ACCμRA 100
Purchase period: 2018.11.05

Important Specifications
  1. Upper chip size: <10 mm; Lower chip size: <100 mm
  2. Temperature range: R.T. ~ 400 °C
  3. Pressure range: 1 ~ 1000 N
  4. Best alignment accuracy: ±2 μm
  5. Automatic alignment system
Services
Thermocompression bonding process (Chip-Chip, Chip-Wafer)

Opening Hours
  1. Monday to Friday: 08:00 ~ 17:00
  2. Nights, Saturdays and Sundays: Closed
System opening level
  1. General working hours: Level C
  2. Night and holiday hours: Closed
Level Description
  • Level A: Open to students who need to use it. They can operate it on their own after training and assessment.
  • Level B: Each professor nominates one student for training, while the rest operate under those who have been trained. Professors with multiple students using the instrument can request an increase in the number of students receiving training.
  • Level C: The instrument administrator selects several students recommended by the professor to receive training. After passing the assessment, they can self-operate the instrument and be responsible for delegated operation service.
  • Level D: The laboratory's technical staff only accept delegated services and are unavailable for general use.
Charging standards
  Delegated operation Self-Operation
Unit Academic unit Manufacturers and research units Academic units Manufacturers and research units
Start-up Fee NT$500 NT$1,000 Not open Not open
Bonding Process NT$1,000/time NT$5,000/time Not open Not open

Remark:
  1. Academic units refer to colleges and universities.
  2. There is no guarantee that the bonding process results will be successful due to the many factors that affect the bonding outcome, despite being calculated based on the actual number of bonding processes.
Management and Usage Methods:
  1. This system is mainly based on academic research and supplemented by services.
  2. Please discuss with the technician one week before the working day when entrusting OEM services.
  3. Sample delivery specifications:
    1. Volatile, corrosive, and toxic samples are prohibited.
    2. Polymer and other materials must be placed on a hard substrate (Si, glass…)
  4. The client will bear the maintenance costs if the instrument is damaged due to OEM samples.
Instrument training operation application instructions
Eligibility for use: This instrument is only open to the person in charge of the instrument and the technical personnel of this laboratory

Instrument operation appointment:
Please contact the management staff, student Hsu, Mu-Ping TEL:03-5712121 #54241
Instrument List of GuanFu and Boai Campus Semiconductor Process
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