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NYCU Office of Research and Development

Semiconductor Process

  • Update Date:2024-04-30
  • Units:Instrumentation Resource Center
[GuanFu] KD-Sputter-Load luck (Sputter C)
Multi-cavity magnetron plasma thin film system
  • KD-Sputter-Load luck
    • Abbreviation: Sputter C
    • Brand: Gordon
    • Model: Sputter – Load Luck
  • Instrument Expert: Prof. Lin, Horng-Chih
    • ext 54193
  • Instrument Operation Technician: Liu, Ping-Che
  • Instrument Location: Room 304, 3rd Floor, Nano Facility Center (clean room)
Instrument brand, model, purchase period
Brand: Gordon
Model: Sputter – Load Luck
Purchase period: November 2021

Important Specifications
  1. HMI
  2. Two 6" sputter cathodes
  3. 1 piece of WAFER can be placed at a time (6 inches or 4 inches can be used; 4 inches must be attached to the slide)
  4. POWER: DC: 1500W*1 unit and RF: 1000W*1 unit
  5. Gases: MFC for Ar and O2
  6. Pumping system: RP + Turbo Pump
  7. Substrate stage speed 5rpm, adjustable
  8. Can heat up to 300 °C
  9. Target types: ZnO and IGZO
  • Open for ZnO, IGZO thin film sputtering
  • Standard process parameters:
    • Wattage: 100 W
    • Ar=50 sccm
    • O2=0~1 sccm
    • Process pressure: 5 mtorr
    • Process temperature: room temperature
  • The above conditions are preferable to thin film conditions, which have been confirmed by TFT fabrication and characteristic measurement.
  • If you need to use non-standard process parameters to deposit thin films, please write or call the operating technician in advance and do a plating rate test.
  • Coating Restrictions:
    • O2 flow≤5sccm
    • O2=0sccm Thickness ≦ 500nm
    • O2=1sccm Thickness ≦ 150nm
    • O2>1sccm Thickness ≦ 100nm
    • Sputtering wattage ≦ 200W (too high reflectivity will cause the machine to alarm)
    • Deposition temperature <200°C (too high reflectivity may cause machine alarm)
    • Deposition pressure 5~20mtorr
Opening Hours
  1. Monday to Friday: 13:00~17:00 for commissioned operations
  2. Night time, Saturday and Sunday: Closed
System Opening Level
  1. General working hours: Level D
  2. Night time and holiday period: Level D

Level Description
  • Level A: Open to students who need to use it. They can operate it on their own after training and assessment.
  • Level B: Each professor nominates one student for training, while the rest operate under those who have been trained. Professors with multiple students using the instrument can request an increase in the number of students receiving training.
  • Level C: The instrument administrator selects several students recommended by the professor to receive training. After passing the assessment, they can self-operate the instrument and be responsible for delegated operation service.
  • Level D: The laboratory's technical staff only accept delegated services and are unavailable for general use..
                 
Charge Standards
(Unit: NTD) Academic unit
Non-saving/saving members
Manufacturers and research units
Non-saving/saving members
Delegated operation
(The machine is not open to self-operation)
Start-up fee: 1500
Usage fee: 1000/750 (per hour)
Start-up fee: 3000
Usage fee: 2000/1500 (per hour)

Note: Academic units refer to colleges and universities.
 
Management and Usage Methods
  1. This machine is only intended for depositing two types of metal oxide films, namely ZnO and IGZO. The deposition conditions must comply with the guidelines specified in the service items. 
  2. To maintain the quality of the sputtered film, plating rate tests and machine maintenance are conducted once a month, according to a fixed schedule. 
  3. To ensure the deposition film environment remains uncontaminated, this machine must not be used to process copper test pieces, test pieces that have undergone copper plating, or test pieces containing volatile organic compounds. Please take note of this restriction.
Instructions for Application for Instrument Training Operation
Not open for training

Instrument Operation Reservation: How to Apply for a Commissioned Operation
  1. Contact the instrument contact person for delegated operation by phone or E-mail.
  2. Please describe in detail the structure of the test piece, the material to be plated, and the deposition conditions.
  3. The applicant should send the test piece to the instrument contact person at least one week before reservation. Please discuss the details with the contact person before making a reservation.
  4. Each commissioned period is limited to coating one 6-inch wafer. Wafers under 4 inches and fragments should be pasted on the 6-inch slide before coating.
  5. The instrument technician may request the applicant to conduct experiments together on-site if necessary.
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